(footprint "MICROBUILDER__0805MP" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 0) (descr "0805 MicroPitch") (fp_text reference "REF**" (at -1.5875 -0.9525) (layer "F.SilkS") (effects (font (size 0.666496 0.666496) (thickness 0.146304)) (justify left bottom)) (tstamp 6d480cb3-ccbc-4f91-b215-36d9b6b90e39) ) (fp_text value ">VALUE" (at -1.5875 1.27) (layer "F.Fab") (effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom)) (tstamp 6bb67786-fe79-4530-a8f0-ca53290823df) ) (fp_poly (pts (xy -0.1999 0.5001) (xy 0.1999 0.5001) (xy 0.1999 -0.5001) (xy -0.1999 -0.5001) ) (layer "F.Adhes") (width 0) (fill solid) (tstamp 9e351c4d-f895-49c5-ba3f-cecde3dc6e44)) (fp_line (start 0 -0.508) (end 0 0.508) (layer "F.SilkS") (width 0.2032) (tstamp 629c7bfb-b888-4932-aba0-6916a21e7f67)) (fp_line (start -0.51 0.535) (end 0.51 0.535) (layer "F.Fab") (width 0.1016) (tstamp 22396a4f-3f2f-4a10-9672-ef964a1e15ec)) (fp_line (start -0.51 -0.535) (end 0.51 -0.535) (layer "F.Fab") (width 0.1016) (tstamp 90cacfdf-b07f-4151-ac89-23042124f640)) (fp_poly (pts (xy 0.4064 0.65) (xy 1 0.65) (xy 1 -0.65) (xy 0.4064 -0.65) ) (layer "F.Fab") (width 0) (fill solid) (tstamp 0138f6cb-7190-4a12-af47-1e018fd27b3c)) (fp_poly (pts (xy -1 0.65) (xy -0.4168 0.65) (xy -0.4168 -0.65) (xy -1 -0.65) ) (layer "F.Fab") (width 0) (fill solid) (tstamp 637ecbcd-a78f-4c8a-8dcf-472bde2de83b)) (pad "1" smd rect (at -1.016 0) (size 1.2 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.0635) (tstamp bd23358d-4a17-4f52-b69d-122e91d97c44)) (pad "2" smd rect (at 1.016 0) (size 1.2 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0.0635) (tstamp 165d5fb4-7aca-4db2-a5bd-306d43842183)) )